| Title | An open letter to members of the IEEE Dielectrics and Electrical Insulation Society |
| Publication Type | Journal Article |
| Year of Publication | 2008 |
| Authors | Dissado, E.L., Laurent C., Montanari G.C., Shimizu N., Fothergill J., Lewin P., Sekii Y., Nelson K., Densley J., Morshuis P., Rowland S., Gerhard R., Okamoto T., Arnold W.M., Stevens G., Vaughan A., Fukunaga K., Chen G., da Silva E., Fouracre T., and Holboll J.T. |
| Journal | IEEE Electrical Insulation Magazine |
| Volume | 24 |
| Issue | 5 |
| Pagination | 4 |
| Date Published | 2008 |
| ISSN | 08837554 (ISSN) |
| URL | http://www.scopus.com/inward/record.url?eid=2-s2.0-54249092477&partnerID=40&md5=4b24c24b1d10be1fbd799cd199e563f9 |
| DOI | 10.1109/MEI.2008.4635654 |
